A cutting-edge technology company specialising in wire bonder upgrading kit to enhance wire bonder to perform  beyond their expectations. The existing  wire bonding  capability can be improved from normal pitch to fine pitch bonding and the bonding quality will also be enhanced.

We also specialise in Semicon equipments such as Gold Wire Bonder, Die Bonder, Flip Chip Bonder, Aluminium Wedge Bonder, Leadframe Inspection System, material supplies such as BGA Solder Sphere  Balls and other innovative products and services.    

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