 |
SOLDER SPHERES |
|
|
Introduction
| As the microelectronics industry is
rapidly progressing, IC devices are required to be more powerful, smaller,
lighter and with more multipoint connections. The revolutionary BGA
or commonly known as "Solder Ball Packaging" technology
will soon be replacing the traditional SMT technology, which will
ultimately be bounded by its limitations. Today, the "Solder Ball
Packaging" technology, is therefore becoming the mainstream
technology for the IC packaging industry.
STAR SPHERES solder sphere balls are professionally manufactured and developed in Taiwan by a group of electronic, chemical material and mechanical specialists. The solder sphere balls are applicable for the "Solder Ball Packaging" devices such as BGA and CSP packages. STAR SPHERES solder sphere balls are produced with auto-mechanical process which is highly stable, reliable and efficient. Strict QA system using cutting-edge QC equipments ensures all end-products with excellent quality within required specifications. STAR SPHERES solder sphere balls have been tested with satisfactory results by numerous leading domestic and international IC packaging companies. STAR SPHERES are also well recognised and accepted by these companies due to not only their excellent quality and accuracy but also price competitiveness and consistency in supply. |
Types of Solder Spheres
|
Standard Type
|
Solder Spheres Specifications
|
|
Melting Points of Solder Spheres
|
|
Solder Spheres Standard Packing Chart
|
