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FED-1780FAM |
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DIE BONDER |
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SHIBAURA FED-1780 FAM Compact BGA, CSP Epoxy Die Bonder is developed for 8 inch wafer. It has very high bonding accuracy, compact in size and simple operation with user-friendly touch panel. |
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High Bonding Accuracy
| Specifications |
| Model | FED-1780FAM | ||
| Bonding speed | 0.45 sec / die | ||
| Bonding accuracy | XY: +- 25 µm, @ +-0.5° * | ||
| Bonding area | 50 x 50 mm | ||
| Die supply | needle pin / vacuum chuck | ||
| Wafer supply | automatic water charge | ||
| Pricisor | non-contact type (xy @ compension by PRS) | ||
| Frame position | Pin location / Gray scale PRS | ||
| Bonding method | Epoxy (pen writing mode) | ||
| Power Supply | AC100V +- 5V, Single phase 50/60 Hz. | ||
| Compressed air | Air 0.4 ~ 0.5 MPa (60 liters ./ min) | ||
| Vacuum | -75 kPa above (100 liters / min) | ||
| Unit Dimensions | 1100 (W) x 1055 (D) x 1650 (H) mm | ||
| Unit mass | approx. 750 kg | ||
| Country Of Origin
/ Manufacture |
Japan |
| Lead Frame Size |
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Width |
15 ~ 70 mm |
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| Length |
95 ~ 250 mm |
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| Pitch |
5 ~ 60 mm |
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| Thickness |
0.07 ~ 0.6 mm |
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| Pellet size |
3 ~ 21 mm (Option: 0.8 ~ 15mm) |
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| Pellet thickness |
0.25 ~ 0.6 mm |
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| Wafer diameter |
MAX 8 inches (200mm) |
| Other Models |
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