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TFC-1000M |
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FLIP CHIP BONDER |
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SHIBAURA TFC-1000M High Speed Flip Chip Bonder is newly developed to be used in the manufacturing process of BGA / CSP. These ICs are becoming more and more essential which are use to produce smaller and more capable electronic devices. This high speed bonder contribute significantly in reducing the IC packaging cost by achieving a tremendous cycle time of only 1.9 seconds per IC. |
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High - Productivity
| Specifications |
| Model | TFC-1000M | ||
| Cycle Time | < 1.9
sec/IC < 2.5 sec/IC (dipping) |
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| Bonding accuracy | +- 10µm | ||
| Bonding force | 5 ~ 196 N | ||
| Die size | 3 ~ 25 mm | ||
| Die thickness | 0.15 ~ 1 mm | ||
| Substrate size | 30 x 120 ~ 100 x 250 mm | ||
| Wafer size | Ø6 inch / Ø8 inch | ||
| Dimension | 1307 (L) x 1094 (W) x 1744 (H) mm | ||
| Country Of Origin
/ Manufacture |
Japan |
