Since 1971, MK Gold Bonding Wire has been developed into various types of gold bonding wire for semiconductor packaging, covering TR to Ultra Fine Pad Pitch package. MK Gold Bonding Wire promises the best production yield for your new Fine Pad Pitch bonding. There are many problems such as ball neck damage, wire sagging, etc.  that cannot be allowed in high speed bonding, automatic bonding, ultra thin package (TSOP, TQFP:1mm thickness or less) and lead on chip package. Under the concept of zero defect, there are six different types of gold bonding wire for conventional and new package application.