SEMICON INDUSTRY |
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Equipments |
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Wire
Bonder Upgrading Kit - "TechStar
U-kit" Electric Fire-Off ( EFO) replacement to enhance wire bonding capabilities. |
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Wire
Bonder - "SHIBAURA" Small foot print and low cost wire bonder. |
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Flip
Chip Bonder - "SHIBAURA" Fully Automated Flip Chip Bonder. |
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Die
Bonder - "SHIBAURA" Compact BGA, CSP Epoxy die bonder for 8inch wafer. |
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Aluminium
Wire Bonder - "Techstar" Dual rotary bonding heads aluminium wire wedge bonder. |
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Leadframe
Inspection System - "INSPEC" Fully automatic inspection systems for different types of leadframe. |
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Consumable Supplies |
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Solder
Sphere Balls - "Star
Spheres" Wide range of solder sphere balls for BGA / CSP / Flip Chip applications. |
