Techstar Upgrading kit - to enhance normal pitch wire bonder to perform fine pitch wire bonding.


		Breaking through the wire bonding barriers............

Introduction

With technology is so advance today, electronic equipments like mobile phones, computers and laptops have become more compact and distinctive. There is a constant need for packaged IC to reduce its size to keep up with such advancement. This relentless pursuit requires IC packaging plant to invest heavily in new wire bonding machines that are able to perform FINE PITCH BONDING targeting at :

	BPA (Bonded Pad Area) appr. 55µm
	BPP (Bond Pad Pitch) appr. 60 µm
	ie. Free Air Ball size have to be <35µm for 25µm diameter of the Gold Wire size.

There are a few new Fine Pitch Gold Wire Bonding machines in the market costing between the range of US$90K to US$130K, eg. K&S 8028 series, Shinkawa UTC470, ASM 339 series, ESEC fine pitch series.

TECHSTAR Upgarding kit is the ideal solution for you !!! It will help you to save millions and millions of dollars!!!!!!! You can now reduce in buying many new machines, just upgrade your existing normal pitch wire bonders by replacing its EFO unit with Techstar Electric Torch upgrading kit. Your existing machine's wire bonding capability will then be able to enhance from normal pitch to fine pitch bonding with Bonded Ball Size less than 5oum. A consistent Free-Air Ball size of 1.2 ~ 1.5 times of the Gold Wire size is always guaranteed, hence also ensuring an improvement in the bonding quality.

Features

With the use of our patented constant current circuitry technology (closed-loop system), we are able to guarantee the consistency and accuracy of the Free Air Ball (FAB) forming with minimum deviation within the applicable GAP length from 0.2mm ~ 2.0mm. This is made possible with the help of the voltage feedback circuit which will detect the change of voltage generated between the wire and electrode (the GAP length); and then automatically adjust the time of current flow during the ball formation in order to compensate for the varying condition caused by inconsistent tail length, etc.

The diameter of the ball can be changed through the variation of constant current or discharged-time parameter.

Upon receiving the trigger signal from the Bonder, ball formation commences. After completion, the torch returns a "Good" signal to Bonder.

It is equipped with a safety device that is able to feedback error signals.

For gold wire of diameter 20um to 50um, Free-Air Ball consistency of 35um to 80um can be composed.

Specifications

	Power Source	AC 100V, AC200V +/- 10%, 50/60Hz
	Output range of constant current	30 ~ 60 mA
	Setup time of constant current	0.2 ~ 2.2 ms
	Maximum discharge voltage	about 2kV ~ 6kV (neg.)
	Applicable wire size	Diameter 20 ~ 50 um
	External resistance	10kohm, 5W
	Type of applicable wire	Au, Gold wire
	Dimension	130 (W) x 220 (D) x 90 (H) mm
	Weight	2.8 kg
	Power consumption	8.5W
	Country Of Origin / Manufacture	Japan

Frequently Asked Questions

What is Techstar Vesta Upgrading Kit ?

It is a full modification upgrading package to enhance wire bonder to further perform beyond its expectation. TechStar Innovations Pte Ltd is solely appointed to handle all sales and services of Vesta Electric Torch outside Japan.

How is it upgraded ?

It is an EXTERNAL MODIFICATION by just replacing your existing EFO unit with our TechStar Vesta Electric Torch. It will NOT INVOLVE any INTERNAL MODIFICATION of internal circuitry, software or changing of accessories such as electrode, transducer, etc.

Why do you need to upgrade ?

The main advantages are:

Able to produce a much smaller Free Air Ball (FAB) of only 1.2 to 1.5 times of the gold wire used, hence enhancing the bonding capability from NORMAL pitch to FINE pitch targeting at:

BPA (Bonded Pad Area) < 55µm
BPP (Bonded Pad Pitch) < 60µm
FAB (Free Air Ball) < 35µm for Ø25µm of gold wire used.
Consistent and Accurate FAB forming.
Consistent Bonding to eliminate defects such as NSOP, Lifted Ball, etc.
Huge Cost Saving of millions of dollars in buying new machines.

Comparison Chart of Wire Bonder
Before and After TechStar Vesta Upgrading

i.e. using Ø25µm gold bonding wire.

Comparison Chart Between TechStar Vesta Upgrading
and New Fine Pitch Wire Bonder

Upgradeable Wire Bonders

	K&S 1488 TURBO / PLUS / TURBO PLUS
	Shinkawa UTC50 / 50.6 / 100 / 105 / 200 / 205
	ASM 309
	Kaijo FB-118 A / C
	TI Abacus IIISE
	ESEC 3006 F/X (In Process)

For other wire bonding machines, please contact our sales team for special customisation.

Want to know more about the fundamentals of Wire Bonding

World-wide Successful Evaluated Customers

	Texas Instruments (Philippines)
	Cypress Semiconductor (Philippines)
	On Semiconductor (Philippines)
	Amkor Technologies (Philippines)
	Sony Semiconductor (Thailand)
	Alphatec (MMI) Semiconductor (Thailand)
	Philips Semiconductor (Thailand / Philippines)
	ChipPac Semiconductor (Korea)
	Micron Semiconductor (Singapore)
	Motorola (China / Malaysia)
	AMD (Thailand)